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Undoped InP

Low-background n-type InP for research and specialty epitaxy.

Design specification
Diameter100.0 ± 0.2 mm
Orientation(100) ± 0.5°; off-cut 0° or 2°
Thickness625 ± 20 µm
Carrier concentration10¹⁵–10¹⁶ cm⁻³
Twins, inclusionsNone in shipped wafers
TTV / warp / bow< 5 / < 10 / < 8 µm
SurfaceEpi-ready