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Semi-insulating GaAs

High-resistivity GaAs for pHEMT and HBT radio chips. Resistivity isolates devices and permits through-wafer vias.

Design specification
Diameter150.0 ± 0.2 mm
Orientation(100) ± 0.5°; off-cut 0° or 2° to [110]
Thickness675 ± 20 µm
Resistivity (RT)> 1×10⁷ Ω·cm; typical 1–5×10⁸
Hall mobility> 5000 cm²/V·s
EPD (average)< 5×10³ cm⁻²
TTV / warp / bow< 10 / < 15 / < 10 µm
SurfaceEpi-ready